Title of the article

Quality assurance arrangements mounting pads high-density backplane

Authors

Gridnev Vladimir Nikolaevich candidate of technical scienсes, associate professor, sub-department of design and the production technology of the electronic equipment, Moscow State Technical University named after N. E. Bauman
Mironova Zhanna Alekseevna postgraduate student, sub-department of design and the production technology of the electronic equipment, Moscow State Technical University named after N. E. Bauman
Shakhnov Vadim Anatol'evich honored worker of science of the Russian Federation, corresponding member of the Russian Academy of Sciences, doctor of technical scienсes, professor, head of sub-department of design and production technology of the electronic equipment, Moscow State Technical University named after N. E. Bauman

Index UDK

621.3.049.75

Abstract

The IC chip feature sizes and contact pads have been constantly reduced. Thus, the continuing increase in component performance and lead density, along with the reduction in package sizes, have required that PСB technology find ways to increase the interconnection density of the substrate. The main attention is paid to a question that serves as a protection from nursing of the solder in the through holes. and low. The described constructions for increase density interconnections of PCB are designed for high quality soldering.

Key words

multilayer wiring board, quality soldering, design wiring board for BGA, filling hole.

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Дата создания: 07.04.2015 10:40
Дата обновления: 07.04.2015 10:40